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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

AS1361 데이터 시트보기 (PDF) - austriamicrosystems AG

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AS1361 Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
AS1361/AS1362
Datasheet - Detailed Description
The maximum power dissipation is calculated:
PDMAX = (TJ - TAMB)/(θJC + θCA)
Where:
TJ - TAMB is the temperature difference between the AS1361/AS1362 die junction and the surrounding air;
θJC is the thermal resistance of the package;
θCA is the thermal resistance through the PC board/copper traces/other materials to the surrounding air.
(EQ 2)
Note: Pin GND of the AS1361/AS1362 provides the electrical connection to system ground and also serves as a heat
sink. Connect pin GND to the system ground using a large pad or ground plane.
Noise Reduction
The AS1361/AS1362 noise bypass circuitry dramatically reduces output noise, exhibiting 9µVRMS of output voltage
noise with CBYPASS = 0.01µF and COUT = 1µF. Use an external 0.01µF bypass capacitor between pin BYPASS and pin
OUT (see Figure 1 on page 1).
Note: Startup time is minimized by internal power-on circuitry which pre-charges CBYPASS.
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