AN-9072 데이터 시트보기 (PDF) - Fairchild Semiconductor
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AN-9072 Datasheet PDF : 3 Pages
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AN-9072
Figure 2. Measurement Point of Package
Surface Flatness
Note:
4. The measurement point of flatness of the package
surface is package center point compared with outside
four points.
APPLICATION NOTE
To get the most effective heat dissipation, it is necessary to
enlarge the contact area as much as possible, which
minimizes the contact thermal resistance.
Properly apply thermal-conductive grease over the contact
surface between a module and heat sink, which is also useful
for preventing the contact surface from corrosion. Ensure
the grease has stable quality and long-term endurance within
a wide operating temperature range. Use a torque wrench to
fasten up to the specified to torque rating. Exceeding the
maximum torque limitation might cause a module to be
damaged or degraded. Pay careful attention not to have any
dirt remaining on the contact surface.
Thermal Compound
Use a minimum 150µm layer of thermal grease to the
module base plate or to the heat sink.
While fastening the module, a rim of thermal compound
must be observed around the mounted module.
Fixing Sequence
Fix all screws 0.5N·m under (by hand or driver).
Apply impact torque maximum 0.8N m crosswise.
Use recommended SEMS screw (included spring/plain
washer M3).
Figure 3. Measurement Point of Heat Sink Flatness
Figure 4. SEMS Screw (Size M3, Spring Washer 5.0Φ,
Plain Washer 7.5Φ)
© 2009 Fairchild Semiconductor Corporation
Rev. 1.0.2 • 4/7/11
2
www.fairchildsemi.com
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