AMC7135 데이터 시트보기 (PDF) - ADDtek Corp
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AMC7135 Datasheet PDF : 6 Pages
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AMC7135
APPLICATION INFORMATION
The Maximum Power Dissipation on Regulator:
PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IQ
VOUT(MAX) = the maximum voltage on output pin;
IOUT(NOM) = the nominal output current;
IQ = the quiescent current the regulator consumes at IOUT(MAX);
VIN(MAX) = the maximum input voltage.
Thermal Consideration:
The maximum junction temperature ratings of AMC7135 should not be exceeded under continuous normal load
conditions. When power consumption is over about 700mW (SOT-89 package, at TA=70°C) or 1000mW (TO-252
package, at TA=70°C), additional heat sink is required to control the junction temperature below 120°C.
The junction temperature is:
TJ = PD (θJT +θCS +θSA ) + TA
PD : Dissipated power.
θJT: Thermal resistance from the junction to the mounting tab of the package.
θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, θCS < 1.0°C /W)
θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size
of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through-hole vias.
PCB θSA (°C /W)
59
PCB heat sink size (mm2) 500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Copyright © 2007 ADDtek Corp.
4
DD031_C -- APRIL 2007
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