ADV7610 데이터 시트보기 (PDF) - Analog Devices
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ADV7610 Datasheet PDF : 16 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
DVDD to GND
PVDD to GND
DVDDIO to GND
CVDD to GND
TVDD to GND
Digital Inputs Voltage to GND
5 V Tolerant Digital Inputs to
GND1
Digital Outputs Voltage to GND
XTALP, XTALN
SCL/SDA Data Pins to DVDDIO
Maximum Junction Temperature
(TJ MAX)
Storage Temperature Range
Infrared Reflow Soldering (20 sec)
Rating
2.2 V
2.2 V
4.0 V
2.2 V
4.0 V
GND − 0.3 V to DVDDIO + 0.3 V
5.3 V
GND − 0.3 V to DVDDIO + 0.3 V
GND − 0.3 V to PVDD + 0.3 V
DVDDIO − 0.3 V to
DVDDIO + 3.6 V
125°C
−60°C to +150°C
260°C
1 The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL, DDCA_SDA,
and RXA_5V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADV7610
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7610, turn
off the unused sections of the part.
Due to the PCB metal variation and, therefore, variation in PCB
heat conductivity, the value of θJA may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this eliminates the variance associated with the θJA value.
Do not exceed the maximum junction temperature (TJ MAX) of
125°C. The following equation calculates the junction temperature
using the measured package surface temperature, and it applies
only when a heat sink is not used on the device under test (DUT):
TJ = TS + (ΨJT × WTOTAL)
where:
TS is the package surface temperature (°C).
ΨJT = 0.4°C/W for the 76-ball CSP_BGA.
WTOTAL = ((PVDD × IPVDD) + (0.05 × TVDD × ITVDD) +
(CVDD × ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO))
where 0.05 is 5% of the TVDD power that is dissipated on the
device itself.
ESD CAUTION
Rev. 0 | Page 7 of 16
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