ADXL001 데이터 시트보기 (PDF) - Analog Devices

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ADXL001

High Performance, Wide Bandwidth Accelerometer

Analog Devices 

RECOMMENDED SOLDERING PROFILE

Table 3. Soldering Profile Parameters

Profile Feature

Average Ramp Rate (TL to TP)

Preheat

Minimum Temperature (TSMIN)

Maximum Temperature (TSMAX)

Time (TSMIN to TSMAX), ts

TSMAX to TL

Ramp-Up Rate

Time Maintained Above Liquidous (tL)

Liquidous Temperature (TL)

Liquidous Time (tL)

Peak Temperature (TP)

Time Within 5°C of Actual Peak Temperature (tP)

Ramp-Down Rate

Time 25°C to Peak Temperature (tPEAK)

Sn63/Pb37

3°C/sec maximum

100°C

150°C

60 sec to 120 sec

3°C/sec

183°C

60 sec to 150 sec

240°C + 0°C/−5°C

10 sec to 30 sec

6°C/sec maximum

6 minute maximum

Soldering Profile Diagram

TP

TL

TSMAX

TSMIN

tP

RAMP-UP

CRITICAL ZONE

TL TO TP

tL

tS

PREHEAT

RAMP-DOWN

tPEAK

TIME (t)

Figure 3. Soldering Profile Diagram

ADXL001

Pb-Free

3°C/sec maximum

150°C

200°C

60 sec to 150 sec

3°C/sec

217°C

60 sec to 150 sec

260°C + 0°C/−5°C

20 sec to 40 sec

6°C/sec maximum

8 minute maximum

Rev. A | Page 5 of 16

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