ADP2108ACBZ-3.0-R7 데이터 시트보기 (PDF) - Analog Devices

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ADP2108ACBZ-3.0-R7

Compact, 600 mA, 3 MHz, Step-Down DC-to-DC Converter

Analog Devices 

ADP2108

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

VIN, EN

FB, SW to GND

Operating Ambient Temperature Range

Operating Junction Temperature Range

Storage Temperature Range

Lead Temperature Range

Soldering (10 sec)

Vapor Phase (60 sec)

Infrared (15 sec)

ESD Human Body Model

ESD Charged Device Model

ESD Machine Model

Rating

−0.4 V to +6.5 V

−1.0 V to (VIN + 0.2 V)

−40°C to +125°C

−40°C to +125°C

−65°C to +150°C

−65°C to +150°C

300°C

215°C

220°C

±1500 V

±500 V

±100 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages

are referenced to GND.

The ADP2108 can be damaged when the junction temperature

limits are exceeded. Monitoring ambient temperature does not

guarantee that TJ is within the specified temperature limits.

In applications with high power dissipation and poor thermal

resistance, the maximum ambient temperature may have to

be derated.

Data Sheet

In applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature (TJ)

of the device is dependent on the ambient temperature (TA),

the power dissipation (PD) of the device, and the junction-to-

ambient thermal resistance of the package (θJA). Maximum

junction temperature (TJ) is calculated from the ambient

temperature (TA) and power dissipation (PD) using the formula

TJ = TA + (PD × θJA).

THERMAL RESISTANCE

θJA is specified for a device mounted on a JEDEC 2S2P PCB.

Table 3. Thermal Resistance

Package Type

θJA

5-Ball WLCSP

105

5-Lead TSOT

170

Unit

°C/W

°C/W

ESD CAUTION

Rev. H | Page 4 of 20

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