ADL5531-EVALZ 데이터 시트보기 (PDF) - Analog Devices
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ADL5531-EVALZ Datasheet PDF : 12 Pages
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Data Sheet
ADL5531
BASIC CONNECTIONS
The basic connections for operating the ADL5531 are shown
in Figure 16. The input and output are ac-coupled with 10 nF
(0402) capacitors. DC bias is provided to the amplifier via an
inductor (Coilcraft 1008CS-471XJLC or equivalent) connected
to the RFOUT pin. The bias voltage should be decoupled using
10 nF and 1 μF capacitors.
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 15 shows the recommended land pattern for ADL5531.
To minimize thermal impedance, the exposed pad on the
package underside is soldered down to a ground plane. If
multiple ground layers exist, they are stitched together using
vias (a minimum of five vias is recommended). Pin 1, Pin 3,
Pin 4, Pin 6, and Pin 8 can be left unconnected or can be connected
to ground. Connecting these pins to ground slightly enhances
thermal impedance. For more information on land pattern design
and layout, refer to AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP).
2.03mm
1
8
4
5
0.71mm
1.53mm
Figure 15. Recommended Land Pattern
L1
470nH
VPOS
(TESTLOOP RED)
C5
C6
10nF 1µF
W1
GND
(TESTLOOP BLACK)
ADL5531
RFIN C1
1 NC
NC 8
C2
RFOUT
2 RFIN
RFOUT 7
10nF
3 NC
NC 6
10nF
4 NC
CLIN 5
C3
1nF
NC = NO CONNECT
Figure 16. Basic Connections
Rev. C | Page 9 of 12
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