datasheetbank_Logo
전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

ADL5531(Rev0) 데이터 시트보기 (PDF) - Analog Devices

부품명
상세내역
일치하는 목록
ADL5531
(Rev.:Rev0)
ADI
Analog Devices ADI
ADL5531 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ADL5531
BASIC CONNECTIONS
The basic connections for operating the ADL5531 are shown
in Figure 15. The input and output are ac-coupled with 10 nF
(0402) capacitors. DC bias is provided to the amplifier via an
inductor (Coilcraft 1008CS-471XJLC or equivalent) connected
to the RFOUT pin. The bias voltage should be decoupled using
10 nF and 1 μF capacitors.
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 14 shows the recommended land pattern for ADL5531.
To minimize thermal impedance, the exposed paddle on the
package underside is soldered down to a ground plane. If
multiple ground layers exist, they are stitched together using
vias (a minimum of five vias is recommended). Pin 1, Pin 3,
Pin 4, Pin 6 and Pin 8 can be left unconnected or can be
connected to ground. Connecting these pins to ground slightly
enhances thermal impedance. For more information on land
pattern design and layout, refer to Application Note AN-772, A
Design and Manufacturing Guide for the Lead Frame Chip Scale
Package (LFCSP).
2.03mm
1
8
4
5
0.71mm
1.53mm
Figure 14. Recommended Land Pattern
L1
470nH
ADL5531
VPOS
(TESTLOOP RED)
C5
C6
10nF 1µF
W1
GND
(TESTLOOP BLACK)
RFIN C1
10nF
1 NC
2 RFIN
3 NC
NC 8
RFOUT 7
NC 6
C2
10nF
RFOUT
4 NC
CLIN 5
C3
1nF
NC = NO CONNECT
Figure 15. Basic Connections
Rev. 0 | Page 9 of 12

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]