ADG419BN_09 데이터 시트보기 (PDF) - Analog Devices
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ADG419BN_09 Datasheet PDF : 16 Pages
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ABSOLUTE MAXIMUM RATINGS
TA= 25°C unless otherwise noted.
Table 3.
Parameter
VDD to VSS
VDD to GND
VSS to GND
VL to GND
Analog, Digital Inputs1
Continuous Current, S or D
Peak Current, S or D (Pulsed at 1 ms,
10% Duty-Cycle Maximum)
Operating Temperature Range
Industrial (B Version)
Extended (T Version)
Storage Temperature Range
Junction Temperature
CERDIP Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering (10 sec)
PDIP Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering (10 sec)
SOIC Package, Power Dissipation
θJA, Thermal Impedance
MSOP Package, Power Dissipation
θJA, Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
44 V
−0.3 V to +25 V
+0.3 V to −25 V
−0.3 V to VDD + 0.3 V
VSS − 2 V to VDD + 2 V
or 30 mA, whichever
occurs first
30 mA
100 mA
−40°C to +125°C
−55°C to +125°C
−65°C to +150°C
150°C
600 mW
110°C/W
300°C
400 mW
100°C/W
260°C
400 mW
155°C/W
315 mW
205°C/W
215°C
220°C
1Overvoltages at IN, S or D is clamped by internal diodes. Limit current to the
maximum ratings given.
ADG419
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. B | Page 5 of 16
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