ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to AGND
VDD to DGND
AGND to DGND
CAP/2.5V
Digital I/O Voltage to DGND
Analog I/O Voltage to AGND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Maximum Junction Temperature
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +0.3 V
2.75 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +125°C
−65°C to +150°C
150°C
300°C
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9837
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
10-Lead LFCSP_WD (CP-10-9) 206
44
Unit
°C/W
ESD CAUTION
Rev. 0 | Page 5 of 28