AD8216 데이터 시트보기 (PDF) - Analog Devices
부품명
상세내역
일치하는 목록
AD8216 Datasheet PDF : 16 Pages
| |||
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AD8216
1
8
7
2
6
3
5
Figure 2. Metallization Diagram
–IN 1
8 +IN
GND 2 AD8216 7 VREF1
VREF2 3 TOP VIEW 6 V+
NC 4 (Not to Scale) 5 OUT
NC = NO CONNECT
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
1
−IN
2
GND
3
VREF2
4
NC
5
OUT
6
V+
7
VREF1
8
+IN
Die size is 1100 µm by 1035 µm.
Die thickness is 13 mil.
Minimum passivation opening (minimum bond pad size)
is 92 µm × 92 µm.
Passivation type is 8 kA USG (Oxide) + 10 kA Oxynitride.
Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu.
Backside potential is V+.
X
−320
−357
−349
NC
+348
+349
+349
+318
Y
+390
+14
−201
NC
−325
−194
−26
+390
Rev. C | Page 5 of 16
Share Link: 