AD6657A(Rev0) 데이터 시트보기 (PDF) - Analog Devices
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AD6657A Datasheet PDF : 36 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD to AGND
DRVDD to AGND
VIN+x, VIN−x to AGND
CLK+, CLK− to AGND
SYNC to AGND
VCMx to AGND
CSB to AGND
SCLK to AGND
SDIO to AGND
PDWN to AGND
MODE to AGND
Digital Outputs to AGND
DCO+AB, DCO−AB, DCO+CD,
DCO−CD to AGND
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−40°C to +85°C
150°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD6657A
THERMAL CHARACTERISTICS
The values in Table 7 are per JEDEC JESD51-7 and JEDEC
JESD25-5 for a 2S2P test board. Typical θJA is specified for a
4-layer printed circuit board (PCB) with a solid ground plane.
As shown in Table 7, airflow improves heat dissipation, which
reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces θJA.
Table 7.
Package Type
Airflow
Velocity θJA1 θJC2 θJB3 Unit
144-Ball CSP_BGA 0 m/s
26.9 8.9 6.6 °C/W
1 m/s
24.2
°C/W
2.5 m/s 23.0
°C/W
1 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
2 Per MIL-STD 883, Method 1012.1.
3 Per JEDEC JESD51-8 (still air).
The values in Table 8 are from simulations. The PCB is a JEDEC
multilayer board. Thermal performance for actual applications
requires careful inspection of the conditions in the application
to determine whether they are similar to those assumed in these
calculations.
Table 8.
Package Type
144-Ball CSP_BGA
Airflow
Velocity
0 m/s
1 m/s
2.5 m/s
JB
JT
Unit
14.4 0.23 °C/W
14.0 0.50 °C/W
13.9 0.53 °C/W
ESD CAUTION
Rev. 0 | Page 11 of 36
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