AD6645(Rev0) 데이터 시트보기 (PDF) - Analog Devices
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AD6645 Datasheet PDF : 20 Pages
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AD6645
OUTLINE DIMENSIONS
Dimensions shown in millimeters and (inches).
52-Lead PowerQuad 4 (LQFP_ED)
(SQ-52)
12.00 (0.472) SQ
7.80 (0.307)
52
1
40
39
2.65 (0.104)
2.50 (0.098) (4 PLCS)
2.35 (0.093)
2.35 (0.093)
2.20 (0.087) (4 PLCS)
2.05 (0.081)
40
39
52
1
TOP VIEW
(PINS DOWN)
10.20 (0.402)
10.00 (0.394) SQ
9.80 (0.386)
EXPOSED
HEATSINK
(CENTERED)
6.00 (0.236)
5.90 (0.232)
5.80 (0.228)
13
14
27
26
0.65 (0.026)
0.38 (0.015)
0.32 (0.013)
0.22 (0.009)
1.60
(0.063)
MAX
0.75 (0.030)
0.60 (0.024)
0.45 (0.018)
SEATING
PLANE
VIEW A
27
26
13
14
6.00 (0.236)
5.90 (0.232)
5.80 (0.228)
BOTTOM VIEW
(PINS UP)
1.45 (0.057)
1.40 (0.055)
1.35 (0.053)
0.15 (0.006)
0.05 (0.002)
0.10 (0.004)
COPLANARITY
VIEW A
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER
EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
THE AD6645 POWERQUAD 4 (LQFP_ED) HAS A THERMALLY AND ELECTRICALLY CONDUCTIVE HEAT SLUG EXPOSED ON THE
BOTTOM OF THE PACKAGE WHICH CAN BE UTILIZED FOR ENHANCED THERMAL MANAGEMENT. IT IS RECOMMENDED THAT
NO UNMASKED ACTIVE PCB TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME INTO CONTACT WITH
THE GROUNDED HEAT SLUG. ALTHOUGH NOT A REQUIREMENT FOR SPECIFIED OPERATION, SOLDERING THE SLUG TO A
GROUND PLANE WITH SUFFICIENT THERMAL CAPACITY WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE. THIS
MAY PROVE BENEFICIAL IN HIGH RELIABILITY APPLICATIONS WHERE LOWER JUNCTION TEMPERATURES TYPICALLY CONTRIBUTE
TO INCREASED SEMICONDUCTOR RELIABILITY.
–20–
REV. 0
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