A3909 데이터 시트보기 (PDF) - Allegro MicroSystems
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A3909 Datasheet PDF : 10 Pages
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A3909
Dual Full Bridge Motor Driver
Package LY, 10-Pin MSOP
With Exposed Thermal Pad
3.00 ±0.10
10
0.30
10
0.50
0° to 6°
1.65
0.15 ±0.05
3.00 ±0.10 4.88 ±0.20
A
1.73 4.60
12
1.98
12
B
1.73
10
0.27
0.18
0.86 ±0.05
SEATING
PLANE
0.50
REF
0.05
0.15
0.53 ±0.10
0.25
Seating Plane
Gauge Plane
1
2
1
1.98 MIN
C
For Reference Only; not for tooling use (reference JEDEC MO-187BA-T)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Exposed thermal pad (bottom surface)
C Reference land pattern layout (reference IPC7351 SOP50P490X110-11M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
Allegro MicroSystems, LLC
9
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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