92HD71B7X3PRG 데이터 시트보기 (PDF) - Integrated Device Technology

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12. SOLDER REFLOW PROFILE

12.1. Standard Reflow Profile Data

Note: These devices can be hand soldered at 360 oC for 3 to 5 seconds.

FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid

State Surface Mount Devices” (www.jedec.org/download).

Table 23. Standard Reflow Profile

Profile Feature

Average Ramp-Up Rate (Tsmax - Tp)

Preheat:

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin - tsmax)

Time maintained above:

Temperature (TL)

Time (tL)

Peak / Classification Temperature (Tp)

Time within 5 oC of actual Peak Temperature (tp)

Ramp-Down rate

Time 25 oC to Peak Temperature

3 oC / second max

150 oC

200 oC

60 - 180 seconds

217 oC

60 - 150 seconds

Pb Free Assembly

See “Package Classification Reflow Temperatures”

on page 214.

20 - 40 seconds

6 oC / second max

8 minutes max

Note: All temperatures refer to topside of the package, measured on the package body surface.

Figure 15. Solder Reflow Profile

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