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74ACT373 데이터 시트보기 (PDF) - Fairchild Semiconductor

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74ACT373
Fairchild
Fairchild Semiconductor Fairchild
74ACT373 Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Physical Dimensions
20
B
13.00
12.60
11.43
A
11
10.65 7.60
10.00 7.40
9.50
2.25
1
PIN ONE
INDICATOR
0.51
0.35
10
1.27
0.25 M C B A
0.65
1.27
LAND PATTERN RECOMMENDATION
2.65 MAX
SEE DETAIL A
(R0.10)
(R0.10)
8°
0°
1.27
0.40
(1.40)
0.75
0.25
X
45°
0.30
0.10
C
0.10 C
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
0.33
0.20
GAGE PLANE
0.25
SEATING PLANE
DETAIL A
SCALE: 2:1
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) CONFORMS TO ASME Y14.5M-1994
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
F) DRAWING FILENAME: MKT-M20BREV3
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1988 Fairchild Semiconductor Corporation
74AC373, 74ACT373 Rev. 1.5.0
9
www.fairchildsemi.com

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