MCZ34701 데이터 시트보기 (PDF) - Freescale Semiconductor

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MCZ34701

1.5A Switch-Mode Power Supply with Linear Regulator

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Rating

Symbol

Value

Unit

THERMAL RATINGS

Storage Temperature

Peak Package Reflow Temperature During Reflow(2), (3)

TSTG

TPPRT

-65 to 150

°C

Note 3

°C

Maximum Junction Temperature

TJMAX

125

°C

Thermal Resistance

Junction to Ambient (Single Layer)(4), (5)

Junction to Ambient (Four Layers)(4), (5)

RθJA

°C/W

70

55

Thermal Resistance, Junction to Base(6)

RθJB

18

°C/W

Operational Package Temperature (Ambient Temperature)

TA

-40 to 85

°C

Notes

2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3. Freescale’s package reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.

5. Per JEDEC JESD51-6 with the board horizontal

6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board near the package.

34701

6

Analog Integrated Circuit Device Data

Freescale Semiconductor

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