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33394

Switch Mode Power Supply with Multiple Linear Regulators and High Speed CAN Transcelver

Freescale Semiconductor 

Freescale Se3m33ic94onductor, Inc.

1. MAXIMUM RATINGS (Maximum Ratings indicate sustained limits beyond which damage to the device may occur.

Voltage parameters are absolute voltages referenced to ground.)

Parameter

Min.

Max.

Unit

Supply Voltage (VBAT), Load Dump

–0.3

+45

V

Supply Voltage (KA_VBAT, VIGN), Load Dump

–18

+45

V

Supply Voltages (VDDH, VPP, VDD3_3, VDDL, VKAM)

–0.3

+5.8

V

Supply Voltages (VREF1, VREF2, VREF3, VSEN)

–2.0

+18

V

CANL, CANH (0<VBAT<18 VDC no time limit)

–18

+26.5

V

ESD Voltage

Human Body Model all pins

Machine Model all pins

(Note 1)

(Note 2)

–2.0

–200

+2.0

kV

+200

V

CANLesd, CANHesd

(Note 1)

–4.0

+4.0

kV

CANLesd, CANHesd

(Note 2)

–200

+200

V

CANLtransient, CANHtransient

(Note 3)

–200

+200

V

/SLEEP

–18

+45

V

REGON, VPP_EN, /HRESET, /PORESET, /PRERESET, HRT, DO, DI, CS, SCLK

–0.3

+7.0

V

CANTXD, CANRXD

–0.3

+7.0

V

Operational Package Temperature [Ambient Temperature]

–40

+125

°C

Storage Temperature

–65

+150

°C

Power Dissipation (TA = 125_C)

44 HSOP

44 QFN

54 SOICW–EP

(Note 4)

(Note 4)

(Note 4)

8.3

W

5.0

W

5.0

W

Lead Soldering Temperature

(Note 5)

260

_C

Maximum Junction Temperature

+150

°C

RθJA, Thermal Resistance, Junction to Ambient (44 HSOP)

(Note 6)

41

°C/W

RθJC, Thermal Resistance, Junction to Case (44 HSOP)

(Note 7)

0.2

°C/W

RθJB, Thermal Resistance, Junction to Base (44 HSOP)

(Note 8)

3

°C/W

RθJA, Thermal Resistance, Junction to Ambient (44 QFN)

(Note 6)

77

°C/W

RθJC, Thermal Resistance, Junction to Case (44 QFN)

(Note 7)

1.7

°C/W

RθJB, Thermal Resistance, Junction to Base (44 QFN)

(Note 8)

5.0

°C/W

RθJA, Thermal Resistance, Junction to Ambient (54 SOICW–EP)

(Note 6)

52

°C/W

RθJC, Thermal Resistance, Junction to Case (54 SOICW–EP)

(Note 7)

1.2

°C/W

RθJB, Thermal Resistance, Junction to Base (54 SOICW–EP)

(Note 8)

8.1

°C/W

1. Human body model: C = 100 pF, R = 1.5 kΩ.

2. Machine model: C = 200 pF, R = 10 Ω and L = 0.75 µH. In case of a discharge from pin CANL to pin GND: – 100 V < CANL transient < +100

V; in case of a discharge from pin CANH to Vcc: –150 V < CANH transient < +150 V.

3. The waveforms of the applied transients is in accordance with ”ISO 7637 part 1” test pulses 1, 2, 3a and 3b.

4. Maximum power dissipation at indicated junction temperature.

5. Lead soldering temperature limit is for 10 seconds maximum duration; contact Motorola Sales Office for device immersion soldering

time/temperature limits.

6. Thermal resistance measured in accordance with EIA/JESD51–2.

7. Theoretical thermal resistance from the die junction to the exposed pad.

8. Thermal resistance measured in accordance with JESD51–8.

2. RECOMMENDED OPERATING CONDITIONS (All voltages are with respect to ground unless otherwise noted)

Parameter

Supply Voltages (VBAT, KA_VBAT)

Switching Regulator Output Current (IVPRE)

VDDH Output Current

(Note 1)

VDD3_3 Output Current

VDDL_B Pass Transistor Base Drive Current

VPP Output Current

VREF Output Current

VSEN Output Current

VKAM Standby Output Current (normal mode of operation)

VKAM Standby Output Current (standby mode of operation)

1. See Typical Application Diagram in Figure 1.

Value

Unit

4.0 to 26.5

V

0 to 1.2

A

0 to 400

mA

0 to 120

mA

0 to 40

mA

0 to 150

mA

0 to 100

mA

0 to 125

mA

0 to 60

mA

0 to 12

mA

For More Information On This Product,

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