ETF6122 데이터 시트보기 (PDF) - TriQuint Semiconductor
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ETF6122 Datasheet PDF : 23 Pages
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TQ6122
Figure 10. Package Dimensions
0.015
0.050
0.125
0.035
PIN 12
TOP VIEW
0.65
SQUARE
0.805
NOMINAL
PIN 1
Figure 11. Mounting Footprint
PIN 23
All Dimensions in Inches
PIN 12
0.060
0.005
0.025
0.050
0.425
0.350
SOLDER PAD
PIN 34
Package Outline
(For Reference Only)
PIN 1
All Dimensions in Inches
Figure 12. Heat-Sink Mounting Arrangement (heat sink not included)
THERMALLOY TYPE 2291C TOP
Use Loctite “Output” Thermal
Conductive Adhesive (Loctite item
number 00241) or equivalent to
attach heat sink base to IC.
THERMALLOY
TYPE 2291C
BASE
DAC IC
THERMAL
ADHESIVE
For additional information and latest specifications, see our website: www.triquint.com
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