APR3101 데이터 시트보기 (PDF) - Anpec Electronics

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APR3101

Micropower Microprocessor Reset Circuit with Manual Reset

Anpec Electronics 

APR3101/2/3

Physical Specifications

Terminal Material

Lead Solderability

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition (IR/Convection or VPR Reflow)

TP

tp

Critical Zone

R am p-up

TL to TP

TL

tL

Tsm ax

Tsm in

ts

Preheat

R am p-down

25

t 25 °C to Peak

Classificatin Reflow Profiles

Tim e

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Large Body

Small Body

Large Body

Small Body

Average ramp-up rate

(TL to TP)

Preheat

- Temperature Min (Tsmin)

- Temperature Mix (Tsmax)

- Time (min to max)(ts)

3°C/second max.

100°C

150°C

60-120 seconds

3°C/second max.

150°C

200°C

60-180 seconds

Tsmax to TL

- Temperature(TL)

- Time (tL)

Peak Temperature(Tp)

183°C

60-150 seconds

3°C/second max

217°C

60-150 seconds

Time within 5°C of actual Peak

Temperature(tp)

225 +0/-5°C

240 +0/-5°C

245 +0/-5°C 250 +0/-5°C

Ramp-down Rate

10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds

Time 25°C to Peak Temperature

6°C/second max.

6°C/second max.

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package. Measured on the body surface.

Copyright  ANPEC Electronics Corp.

12

Rev. A.3 - Feb., 2004

www.anpec.com.tw

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