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AD8120ACPZ-RL

Triple Skew-Compensating Video Delay Line with Analog and Digital Control

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Supply Voltage

Internal Power Dissipation

32-Lead LFCSP at TA = 25°C

Input Voltage

Storage Temperature Range

Operating Temperature Range

Lead Temperature

(Soldering 10 sec)

Junction Temperature

Rating

±6 V

3.5 W

VS− − 0.3 V to VS+ + 0.3 V

−65°C to +125°C

−40°C to +85°C

300°C

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, for a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

5 mm × 5 mm, 32-Lead LFCSP

θJA

θJC

Unit

36

2

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the AD8120 package is

limited by its junction temperature. The maximum safe junction

temperature for plastic encapsulated devices, as determined by

the glass transition temperature of the plastic, is approximately

150°C. Temporarily exceeding this limit may cause a shift in the

parametric performance due to a change in the stresses exerted

on the die by the package. Exceeding a junction temperature of

175°C for an extended period can result in device failure.

AD8120

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power dissipation is the voltage between the supply pins (VS+

and VS−) times the quiescent current (IS). Power dissipated due

to load drive depends upon the particular application. It is cal-

culated by multiplying the load current by the associated voltage

drop across the device. RMS voltages and currents must be used

in these calculations.

Airflow increases heat dissipation by reducing θJA.

To ensure optimal thermal performance, the exposed paddle

must be in an optimized thermal connection with an external

plane layer.

6

5

4

3

2

1

0

–40

–20

0

20

40

60

80

AMBIENT TEMPERATURE (°C)

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

on a JEDEC Standard 4-Layer Board

ESD CAUTION

Rev. A | Page 5 of 16

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