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BH0170 데이터 시트보기 (PDF) - Fairchild Semiconductor

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BH0170
Fairchild
Fairchild Semiconductor Fairchild
BH0170 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
Physical Dimensions
9.83
9.00
6.67
6.096
5.08 MAX
3.683
3.20
8.255
7.61
7.62
0.33 MIN
(0.56)
2.54
3.60
3.00
0.56
0.355
1.65
1.27
7.62
0.356
0.20
9.957
7.87
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO
JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANCES PER
ASME Y14.5M-1994
E) DRAWING FILENAME AND REVSION: MKT-N08FREV2.
Figure 35. 8-pin Dual In-Line Package (DIP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FSBH0F70A, FSBH0170/A, FSBH0270/A, FSBH0370 • Rev. 1.0.1
15
www.fairchildsemi.com

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