MF-SM185 데이터 시트보기 (PDF) - Bourns, Inc

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MF-SM185

MF-SM Series - PTC Resettable Fuses

Bourns, Inc 

MF-SM Series - PTC Resettable Fuses

Typical Time to Trip at 23 °C

100

Typical Part Marking

Represents total content. Layout may vary.

MANUFACTURER'S

TRADEMARK

030

0A

PART IDENTIFICATION

DATE CODE -

WEEK 1 OF 2000 = 0A

(YEAR & WEEK)

WEEK 27 OF 2000 = A0

(WEEK & YEAR)

10

1

0.1

0.01

0.001

0.1

1

10

Fault Current (Amps)

Solder Reflow Recommendations

300

Preheating

Soldering

Cooling

250

200

150

100

50

0

160–220

10–20

120

Time (seconds)

100

Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.

• Devices are not designed to be wave soldered to the bottom side of the

board.

• Gluing the devices is not recommended.

• Recommended maximum paste thickness is 0.25 mm (.010 inch).

• Devices can be cleaned using standard industry methods and solvents.

Note:

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

Rework

• A device should not be reworked.

Storage Recommendations

The recommended long term storage conditions for Multifuse® Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All devices should

remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage

recommendations are exceeded. Devices stored in this manner have an indefinite shelf life.

MF-SM SERIES, REV. T, 01/16

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

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