TGF4118 데이터 시트보기 (PDF) - TriQuint Semiconductor
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TGF4118 Datasheet PDF : 9 Pages
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Thermal Model of TGF4118-EPU
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Predicted Channel Temperature vs Base Plate Temperature
With a .020" CM15 (15/85 Copper Molybdenum) carrier plate solder attached
using 0.0015" AuSn (80/20) solder
Pd = 5 Watts
Pd = 10 Watts
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Base Plate Temperature (°C)
Tc = 2.052 + 6.796 x Pd + 0.1465 x Pd 2 + (1.002 + 0.01999 x Pd + 0.0002725 x Pd 2) x Tbase
(Predicted Channel Temperature equation for the given assembly stack up)
This model assumes perfect solder connections (no voids) between the FET and the carrier plate.
HFETChannel Temperature vs Median Life
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Median Life (10^X Hours)
TriQuint Semiconductor Texas Phone: 972 994-8465 Fax 972 994-8504
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Web: www.triquint.com 7
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