High Current, 10Ω, SPST, CMOS
Analog Switches
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
D
1
PIN 1
INDEX
AREA
A
A2
L
D2
PIN 1 ID
N
1
C0.35
b
E
E2
[(N/2)-1] x e
REF.
DETAIL A
e
A1
k
CL
L
e
A
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
CL
L
e
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
1
D2
COMMON DIMENSIONS
SYMBOL MIN. MAX.
A
0.70
0.80
D
2.90
3.10
E
2.90
3.10
A1
0.00
0.05
L
0.20
0.40
k
0.25 MIN.
A2
0.20 REF.
PACKAGE VARIATIONS
PKG. CODE
N
D2
T633-1
6 1.50±0.10
T833-1
8 1.50±0.10
T1033-1
10 1.50±0.10
E2
2.30±0.10
2.30±0.10
2.30±0.10
e
0.95 BSC
0.65 BSC
0.50 BSC
JEDEC SPEC
MO229 / WEEA
MO229 / WEEC
MO229 / WEED-3
b
[(N/2)-1] x e
0.40±0.05 1.90 REF
0.30±0.05 1.95 REF
0.25±0.05 2.00 REF
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
2
D2
10 ______________________________________________________________________________________