ADV7520NKBBCZ-80 데이터 시트보기 (PDF) - Analog Devices
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ADV7520NKBBCZ-80 Datasheet PDF : 5 Pages
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ADV7520NK
Preliminary Technical Data
OUTLINE DIMENSIONS
9.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
64 PIN LFCSP PACKAGE DIMENSIONS
0.60 MAX
0.60 MAX
49
48
0.30
0.25
0.18
64 1
PIN 1
INDICATOR
8.75
BSC SQ
+
EXPOSED PAD**
(BOTTO M VIEW)
4.85
4.70 SQ*
4.55
1.00
0.85
0.80
12° MAX
SEATING
PLANE
0.45
0.40
33
0.35
32
0.80 MAX
0.65 TYP
0.50 BSC
0.05 MAX
0.02 NOM
0.20 REF
7.50
REF
16
17
64 LFCSP (LEAD FRAME CHIP SCALE PACKAGE)
*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
**Note: PAD is CONNECTED to GND
DIMENSIONS in Millimeters
Figure 6. 64-pin LFCSP
Dimensions shown in millimeters
*1.40 MAX
6.10
6.00 SQ
5.90
BALL A1
PAD CORNER
TOP VIEW
DETAIL A
4.50
BSC SQ
0.50
BSC
0.75
REF
0.15 MIN
A1 CORNER
INDEX AREA
10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
BOTTOM VIEW
DETAILA
0.65 MIN
0.35 SEATING
0.30 PLANE
0.25
BALL DIAMETER
COPLANARITY
0.08 MAX
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
Figure 7. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
6 mm × 6 mm × 1.4 mm
(BC-76)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADV7520NKBCPZ-801
ADV7520NKBBCZ-80
ADV7520NKBBCZRL-80
ADV7520NK/PCBZ
Temp. Range
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
1 All packages are RoHS compliant
Package Description
64-pin Lead Formed Chip Scale Package
76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board
Package Option
CP-64
BC-76
BC-76
Rev. PrA | Page 4 of 5
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