5SMX12K1701 데이터 시트보기 (PDF) - ABB

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5SMX12K1701

IGBT-Die

ABB 

60; .

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Overall die L x W

11.9 x 11.9

8QLW

mm

Dimensions

exposed L x W (except gate pad)

front metal

gate pad L x W

9.9 x 9.9

mm

1.2 x 1.2

mm

Metallization 1)

thickness

front

back

AISi1

AI / Ti / Ni / Ag

210 ± 15

µm

4

µm

1.2

µm

1) For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors,

Doc. No. 5SYA2033-01 April 02.

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G

Emitter

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Doc. No. 5SYA1619-01 July 03

page 3 of 5

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