UPC4250C 데이터 시트보기 (PDF) - NEC => Renesas Technology

부품명

상세내역

일치하는 목록

UPC4250C

PROGRAMMABLE OPERATIONAL AMPLIFIER

NEC => Renesas Technology 

µPC4250

5 RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales

offices.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"(C10535E).

Type of Surface Mount Device

µPC4250G2: 8-pin plastic SOP (5.72 mm (225))

Process

Infrared Ray Reflow

Vapor Phase Soldering

Wave Soldering

Partial Heating Method

Conditions

Peak temperature: 235°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflow processes: 3 time.

Peak temperature: 215°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflow processes: 3 time.

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR35-00-3

VP15-00-3

WS60-00-1

–

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.

Type of Through-hole Device

µPC4250C: 8-pin plastic DIP (7.62 mm (300))

Process

Wave Soldering

(only to leads)

Partial Heating Method

Conditions

Solder temperature: 260°C or below,

Flow time: 10 seconds or less.

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (per each lead).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that

the package body does not get jet soldered.

10

Data Sheet G15640EJ3V0DS

Share Link: