ST7712
3. Pad Arrangement
Chip size (um): 15,800x1,380
PAD coordinate: PAD center
Coordinate origin: Chip center
Chip thickness (um): 400±25
Bump height (um):15±2
Pad Arrangement (Unit: um):
Pad No. 1~ Pad No. 534: 26 x 86
26 30 26
86
116
30
86
28 28
Pad No. 535~ Pad No. 692: 66 x 76
25
66 (min.) 66
76
95
(min.)
Alignment Mark (Unit: um):
Ver 2.3
2/113
2007/07/19