Extended Electrical Characteristics (GTLP)
Over recommended ranges of supply voltage and operating free-air temperature VREF = 1.0V (unless otherwise noted).
CL = 30 pF for B Port and CL = 50 pF for A Port.
Symbol
From
To
Min
Typ
Max
Unit
(Input)
(Output)
(Note 14)
tOSLH (Note 15)
A
B
0.4
1.0
ns
tOSHL (Note 15)
0.4
1.0
ns
tPV(HL) (Note 16) (Note 17)
A
B
1.5
ns
tOSLH (Note 15)
CLKAB
B
0.3
0.9
ns
tOSHL (Note 15)
0.3
0.6
ns
tPV(HL) (Note 16)(Note 17)
CLKAB
B
1.2
ns
tOSLH (Note 15)
B
A
0.3
1.0
ns
tOSHL (Note 15)
0.3
1.0
ns
tOST (Note 15)
B
A
0.6
1.5
ns
tPV (Note 16)
B
A
1.6
ns
tOSLH(Note 15)
CLKAB
A
0.3
0.6
ns
tOSHL (Note 15)
0.3
0.6
ns
tOST(Note 15)
CLKAB
A
0.5
1.0
ns
tPV (Note 16)
CLKAB
A
1.1
ns
Note 14: All typical values are at VCC = 3.3V, and TA = 25°C.
Note 15: tOSHL/tOSLH and tOST—Output to output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs
within the same packaged device. The specifications are given for specific worst case VCC and temperature and apply to any outputs switching in the same
direction either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH) or in opposite directions both HL and LH (tOST). This parameter is guaranteed by design and
statistical process distribution. Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance seen by the
device.
Note 16: tPV—Part to part skew is defined as the absolute value of the difference between the actual propagation delay for all outputs from device to device.
The parameter is specified for a specific worst case VCC and temperature. This parameter is guaranteed by design and statistical process distribution. Actual
skew values between the GTLP outputs could vary on the backplane due to the loading and impedance seen by the device.
Note 17: Due to the open drain structure on GTLP outputs, tOST and tPV(LH) in the A-to-B direction are not specified. Skew on these paths is dependent on
the VTT and RT values on the backplane.
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