MBF9042BB 데이터 시트보기 (PDF) - Oki Electric Industry

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MBF9042BB

SAW Antenna Duplexer (700 to 1000 MHz)

Oki Electric Industry 

Semiconductor

FEDW9042BB-02

MBF9042BB

RECOMMENDATION FOR SOLDER PAD PATTERN

The solder pad pattern should be designed by customers because it depends on the electrical performance of the

customers’ system. Following is an example of solder pad pattern which is used in OKI’s package evaluation

board. Please be noted that this is for reference purpose only.

25 µm

0.1 mm

25 µm

0.5 mm

0.1 mm

0.1 mm

PCB pad pattern

Metal mask pattern

Pad of Device

Please pay attention to the following items to maintain electrical performance.

(1) Metal mask pattern for cream solder should be 25 µm smaller on each side. Metal mask is 0.15 mm in

thickness.

(2) As the impedance of Tx, Rx, ANT is designed for 50 Ω, please consider this for the design of mother board.

(3) The performance of these devices is assured when GND pad (Pin 17) is connected. GND pad (Pin 17) should

be soldered in the same way as above.

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