MAX3946ETG 데이터 시트보기 (PDF) - Maxim Integrated

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MAX3946ETG

1Gbps to 11.3Gbps, SFP+ Laser Driver with Laser Impedance Mismatch Tolerance

Maxim Integrated 

1Gbps to 11.3Gbps, SFP+ Laser Driver

with Laser Impedance Mismatch Tolerance

ABSOLUTE MAXIMUM RATINGS

VCC, VCCT, VCCD .................................................-0.3V to +4.0V

Current Into TOUT+ and TOUT-.................................... +100mA

Current Into TIN+ and TIN-.............................. -20mA to +20mA

Voltage Range at TIN+, TIN-,

DISABLE, SDA, SCL, CSEL, FAULT,

BMAX, and BMON................................ -0.3V to (VCC + 0.3V)

Voltage Range at BIAS........................................................-0.3V to VCC

Voltage Range at TOUT+ and TOUT-.....(VCC - 1.3V) to (VCC + 1.3V)

Current into BIAS.........................................................................+130mA

Continuous Power Dissipation (TA = +70NC)

TQFN (derate 27.8mW/NC above +70NC)..................2222mW

Storage Temperature Range ........................... -55NC to +150NC

Die Attach Temperature .................................................+400NC

Lead Temperature (soldering, 10s).................................+300NC

Soldering Temperature (reflow).......................................+260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TQFN

Junction-to-Ambient Thermal Resistance (qJA)...........36°C/W

Junction-to-Case Thermal Resistance (qJC)..................3°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VCC = +2.85V to +3.63V, TA = -40°C to +85°C, and Figure 1. Guaranteed by design and characterization from TA = -40°C to +95°C.

Typical values are at VCC = +3.3V, IBIAS = 60mA, IMOD = 40mA, 25I differential output load, and TA = +25°C, unless otherwise

noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

POWER SUPPLY

Power-Supply Current

ICC

Excludes output current through the exter-

nal pullup inductors (Note 3)

68

90

mA

Power-Supply Voltage

Power-Supply Noise

VCC

DC to 10MHz

10MHz to 20MHz

2.85

3.63

V

100

10

mVP-P

POWER-ON RESET

VCC for Enable High

VCC for Enable Low

DATA INPUT SPECIFICATION

2.55 2.75

V

2.3 2.45

V

Input Data Rate

1

10

11.3 Gbps

Differential Input Voltage

TXEQ_EN = high, launch amplitude into

VIN

FR4 transmission line P 5.5in

0.19

TXEQ_EN = low

0.15

0.7

VP-P

1.0

Differential Input Resistance

Differential Input Return Loss

RIN

SDD11 Part powered on, f P 10GHz

75

100 125

I

12

dB

Common-Mode Input Return

Loss

SCC11 Part powered on, 1GHz P f P 10GHz

10

dB

BIAS GENERATOR

Maximum Bias Current

IBIASMAX

Current into BIAS pin, DISABLE = low, and

TX_EN = high

80

mA

2   _______________________________________________________________________________________

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