BZX284-C75 데이터 시트보기 (PDF) - NXP Semiconductors.

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BZX284-C75

Voltage regulator diodes

NXP Semiconductors. 

Philips Semiconductors

Voltage regulator diodes

Product specification

BZX284 series

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

Rth j-a

thermal resistance from junction to ambient note 1

Note

1. Device mounted on a printed-circuit board: 11 × 25 × 1.6 mm.

VALUE

315

UNIT

K/W

MOUNTING

Reflow soldering

Follow standard reflow soldering techniques to ensure

correct application of solder paste and placement of the

SOD110 package (see Fig.2).

Wave soldering

Before wave soldering, attach SOD110 packages to the

printed-circuit boards using a small dot of thermo-setting

epoxy or UV-curing adhesive centred between the

soldering lands (see Fig.3).

3.00

,,,,,,,,,, handbook, halfpage

1.25

1.00

1.00

MGC119

Dimensions in mm.

Fig.2 SOD110 reflow soldering pattern.

,,,, ,,,,,, handbook,halfpage

3.40

1.25

1.10

1.10 MGC126

Dimensions in mm.

Fig.3 SOD110 wave soldering pattern.

1999 Apr 19

6

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