BW104-S 데이터 시트보기 (PDF) - SEOUL SEMICONDUCTOR

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BW104-S

CHIP LED DEVICE

SEOUL SEMICONDUCTOR 

[Note] ( Tolerance : IV±10%, color coordinate ±0.01, VF ±0.1 )

4. Soldering profile

Reflow Soldering Conditions/ Profile

(1) Lead Solder

-Preliminary heating to be at 150℃max. for 2 minutes max.

-Soldering heat to be at 240℃max. for 5 seconds max.

°C

Operation heating

240

150

Pre-heating

Temperature

rise: 5°C/sec.

120

Cooling:

-5°C/sec.

0

60 to 120 sec.

5sec. max

(2) Lead-Free Solder

-Preliminary heating to be at 150℃max. for 2 minutes max.

-Soldering heat to be at 260℃max. for 10 seconds max.

°C

Operation heating

260

150

Pre-heating

Temperature

rise: 5°C/sec.

120

Cooling:

-5°C/sec.

0

(3) Hand Solder

SSC-QP-0401-06(REV.0)

60 to 120 sec.

5 to 10 sec.

SEOUL SEMICONDUCTOR CO,. LTD.

148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea

TEL: 82-2-3281-6269 FAX: 82-2-858-5537

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SSC-BW104-S

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