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ADC1002S020HL
NXP
NXP Semiconductors. NXP
ADC1002S020HL Datasheet PDF : 19 Pages
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NXP Semiconductors
ADC1002S020
Single 10 bits ADC, up to 20 MHz
Table 6. Characteristics …continued
VDDA = V7 to V9 = 3.3 V; VDDD = V4 to V3 = V18 to V19 = 3.3 V; VDDO = V20 to V21 = 3.3 V; VSSA, VSSD and VSSO shorted
together; Vi(p-p) = 1.83 V; CL = 20 pF; Tamb = 0 °C to 70 °C; typical values measured at Tamb = 25 °C unless otherwise
specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Timing (fclk = 20 MHz; CL = 20 pF); see Figure 4[6]
td(s)
sampling delay time
th(o)
output hold time
td(o)
output delay time
VDDO = 4.75 V
VDDO = 3.15 V
3-state output delay times; see Figure 5
-
-
5
ns
5
-
-
ns
8
12
15
ns
8
17
20
ns
tdZH
float to active HIGH
delay time
-
14
18
ns
tdZL
float to active LOW delay
time
-
16
20
ns
tdHZ
active HIGH to float
delay time
-
16
20
ns
tdLZ
active LOW to float delay
time
-
14
18
ns
Standby mode output delay times
tTLH
LOW to HIGH transition stand-by
time
-
-
200
ns
tTHL
HIGH to LOW transition start-up
time
-
-
500
ns
[1] In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less
than 1 ns.
[2] Analog input voltages producing code 0 up to and including code 1023:
a) Voffset BOTTOM is the difference between the analog input which produces data equal to 00 and the reference voltage on pin RB
(VRB) at Tamb = 25 °C.
b) Voffset TOP is the difference between the reference voltage on pin RT (VRT) and the analog input which produces data outputs equal
to code 1023 at Tamb = 25 °C.
[3] To ensure the optimum linearity performance of such a converter architecture the lower and upper extremities of the converter reference
resistor ladder are connected to pins RB and RT via offset resistors ROB and ROT as shown in Figure 3.
a) The current flowing into the resistor ladder is I = -R---O---V-B----R-+--T--R----L---V-+---R--R-B---O----T-- and the full-scale input range at the converter, to cover code 0
to 1023 is V I = RL × I L = -R---O----B-----+----R-R---LL----+-----R----O----T-- × (V RT + V RB) = 0.871 × (V RT V RB)
b)
Since
RL,
ROB
and
ROT
have
similar
behavior
with
respect
to
process
and
temperature
variation,
the
ratio
------------------R---L-------------------
ROB + RL + ROT
will be kept reasonably constant from device to device. Consequently variation of the output codes at a given input voltage depends
mainly on the difference VRT VRB and its variation with temperature and supply voltage. When several ADCs are connected in
parallel and fed with the same reference source, the matching between each of them is optimized.
[4] The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square
wave signal) in order to sample the signal and obtain correct output data.
[5] Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8000 acquisition points per equivalent fundamental
period. The calculation takes into account all harmonics and noise up to half the clock frequency (Nyquist frequency). Conversion to
SIgnal-to-Noise And Distortion (SINAD) ratio: SINAD = ENOB × 6.02 + 1.76 dB.
[6] Output data acquisition: the output data is available after the maximum delay time of td(o).
ADC1002S020_2
Product data sheet
Rev. 02 — 13 August 2008
© NXP B.V. 2008. All rights reserved.
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