STPS1H100 데이터 시트보기 (PDF) - STMicroelectronics
부품명
상세내역
일치하는 목록
STPS1H100 Datasheet PDF : 10 Pages
| |||
STPS1H100
Characteristics
Figure 13.
Forward voltage drop versus
forward current (maximum values)
Figure 14.
Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMB)
IFM(A)
100.00
10.00
1.00
Tj=125 °C
Tj=25 °C
0.10
VFM(V)
0.01
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Rth(j-a)(°C/W)
120
110
SMB
100
90
80
70
60
50
40
30
S(Cu)(cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 15.
Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA)
Rth(j-a)(°C/W)
140
130
SMA
120
110
100
90
80
70
60
50
40
30
S(Cu)(cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 16.
Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMAflat)
Rth(j-a)(°C/W)
200
180
SMAflat
160
140
120
100
80
60
40
20
S(Cu)(cm²)
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
5/10
Share Link: 