LPC47N227-MV 데이터 시트보기 (PDF) - SMSC -> Microchip
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LPC47N227-MV Datasheet PDF : 5 Pages
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100 Pin Super I/O with LPC Interface for Notebook Applications
PACKAGE OUTLINES
FIGURE 1 – 100 PIN TQN LEAD-FREE PACKAGE OUTLINE
MIN
NOMINAL
MAX
A
~
~
1.60
A1
0.05
~
~
A2
1.35
1.40
1.45
D
15.80
16.00
16.20
D/2
7.90
8.00
8.10
D1
13.90
14.00
14.10
E
15.80
16.00
16.20
E/2
7.90
8.00
8.10
E1
13.90
14.00
14.10
H
~
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.50 Basic
θ
0o
~
8o
W
~
0.25
~
R1
~
0.20
~
R2
~
0.20
~
ccc
~
~
0.0762
ccc
~
~
0.08
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
Notes:
1 Controlling Unit: millimeter
2 Tolerance on the position of the leads is ± 0.04 mm maximum.
3 Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-
1.08 mm.
5 Details of pin 1 identifier are optional but must be located within the zone indicated.
6 Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
Rev. 03-29-07
Page 4
SMSC DB – LPC47N227
PRODUCT PREVIEW
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