STTH208 데이터 시트보기 (PDF) - STMicroelectronics
부품명
상세내역
일치하는 목록
STTH208 Datasheet PDF : 5 Pages
| |||
STTH208/U
Fig. 1: Conduction losses versus average current.
P(W)
3.5
3.0
2.5
2.0
δ = 0.05
δ = 0.1 δ = 0.2
δ = 0.5
δ=1
1.5
1.0
T
0.5
IF(AV)(A)
δ=tp/T
tp
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Fig. 2: Forward voltage drop versus forward
current.
IFM(A)
100.0
Tj=150°C
(maximum values)
10.0
Tj=150°C
(typical values)
Tj=25°C
(maximum values)
1.0
VFM(V)
0.1
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
Fig. 3-1: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, Lleads = 10mm) (DO-15).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
0.0
1.E-01
Single pulse
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 3-2: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, S=1cm2) (SMB).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1
Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 4: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness:
35µm).
Rth(j-a)(°C/W)
110
100
90
80
SMB
70
60
DO-15
50
Lleads=10mm
40
30
20
10
S(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
3/5
Share Link: 