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TDA4865J Datasheet PDF : 18 Pages
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NXP Semiconductors
TDA4865J; TDA4865AJ
Vertical deflection booster
9. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages referenced to pin GND; unless otherwise
specified.
Symbol Parameter
Conditions
Min Max
Unit
VP1
VP2
VFB
VP3
Vi(INN)
Vi(INP)
Vo(VOUT)
IP2
Io(VOUT)
IVFB
IVP3
Tstg
Tamb
Tj
Vesd
supply voltage 1
supply voltage 2
flyback supply voltage of TDA4865J
flyback generator output voltage of TDA4865AJ
input voltage on pin INN
input voltage on pin INP
output voltage on pin VOUT
supply current 2
output current on pin VOUT
current during flyback of TDA4865J
current during flyback of TDA4865AJ
storage temperature
ambient temperature
junction temperature
electrostatic discharge voltage
machine model
human body model
-
40
V
-
70
V
-
70
V
0
VP1 + 3 V
-
VP1
V
-
VP1
V
-
72
V
-
±2.0
A
[1] -
±2.0
A
-
±2.0
A
-
±2.0
A
−25
+150
°C
−20
+75
°C
[1] -
150
°C
[2] −400 +400
V
[3] −4000 +4000 V
[1] Internally limited by thermal protection; will be activated for Tj ≥ 150 °C.
[2] Class C according to EIA/JESD22-A115-A.
[3] Class 3A according to JESD22-A114C.01.
10. Thermal characteristics
Table 6.
Symbol
Rth(j-mb)
Thermal characteristics
Parameter
thermal resistance from junction to mounting base
Conditions
Typ
[1] 4
Unit
K/W
[1] To minimize the thermal resistance from mounting base to heat sink [Rth(mb-h)] follow the recommended mounting instruction: screw
mounting preferred; torque = 40 Ncm; use heat sink compound; isolation plate increases Rth(mb-h).
11. Characteristics
Table 7. Characteristics
VP1 = 25 V; Tamb = 25 °C; voltages referenced to pin GND; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Supplies
VP1
supply voltage 1
VP2
supply voltage 2
VFB
flyback supply voltage of
TDA4865J
9
-
VP1 − 1
-
VP1 − 1
-
TDA4865J_TDA4865AJ_2
Product data sheet
Rev. 02 — 3 November 2006
Max
Unit
35
V
70
V
70
V
© NXP B.V. 2006. All rights reserved.
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