datasheetbank_Logo
전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

KB3310 데이터 시트보기 (PDF) - Unspecified

부품명
상세내역
일치하는 목록
KB3310 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Kingbor Technology Co.,Ltd
TEL:(86)0755-83095458 FAX:(86)0755-88364052
APPLICATION INFORMATION
KB3310
Preliminary Product Information
MicroPower Charge Pump Converter
1. Capacitor Selection
It is very important to select the capacitors CIN, COUT and CFLY because they will affect turn
on time, output ripple and transient performance. Ceramic capacitors offer many advantages
over other tantalum and aluminum electrolytic counterparts. In general, the capacitors can
be used 10PF for CIN and COUT, and 1PF for CFLY under maximum output load conditions.
Lower values for CIN, COUT and CFLY may be utilized for light load current applications.
Large ceramic capacitors are typically composed of X7R, X5R, Z5U or Y5V dielectric
materials. If Y5V and Z5U are selected for used with the charge pump, the nominal value
should be doubled to compensated for the capacitor tolerance which can vary more than
r50% over operating temperature range. X7R and X5R dielectrics are much more desirable.
The temperature tolerance of X7R dielectric is better than r15% .
2. Charge Pump Efficiency
The KB3310 is a regulated output voltage charger pump converter. The Efficiency can be
defined as a linear voltage regulator with an effective output voltage that is equal to two
times the input voltage. The expression to define the ideal efficiency can be shown as:
K POUT
PIN
VOUT u IOUT
VIN u 2IOUT
VOUT
2 uVIN
Refer to the Typical Characteristics section for measured plots of efficiency versus input
voltage and output load current for the given charge pump output voltage options.
3. Layout Guideline
As a general rule for charge pump boost converters, all external capacitors should be located
as closed as possible to the device package with minimum length trace connections. A local
component side ground plane is recommended. If this is not possible due to the layout
limitations, assure good ground connections by the use of large or multiple PCB via’s.
6

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]