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AD6657
(Rev.:Rev0)

Quad IF Receiver

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

AVDD to AGND

DRVDD to AGND

VIN+x, VIN−x to AGND

CLK+, CLK− to AGND

SYNC to AGND

VCMx to AGND

CSB to AGND

SCLK to AGND

SDIO to AGND

PDWN to AGND

MODE to AGND

Digital Outputs to AGND

DCO+AB, DCO−AB, DCO+CD,

DCO−CD to AGND

Operating Temperature Range

(Ambient)

Maximum Junction Temperature

Under Bias

Storage Temperature Range

(Ambient)

Rating

−0.3 V to +2.0 V

−0.3 V to +2.0 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−0.3 V to DRVDD + 0.2 V

−40°C to +85°C

150°C

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

AD6657

THERMAL CHARACTERISTICS

The values in Table 7 are per JEDEC JESD51-7 plus JEDEC

JESD25-5 for a 2S2P test board. Typical θJA is specified for a

4-layer PCB with a solid ground plane. As shown in Table 7,

airflow improves heat dissipation, which reduces θJA. In addi-

tion, metal in direct contact with the package leads from metal

traces, through holes, ground, and power planes reduces θJA.

Table 7.

Package Type

Airflow

Velocity θJA1 θJC2 θJB3

144-Ball CSP_BGA, 0 m/s

26.9 8.9 6.6

10 mm × 10 mm 1 m/s

24.2

(BC-144-1)

2.5 m/s 23.0

1 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

2 Per MIL-STD 883, Method 1012.1.

3 Per JEDEC JESD51-8 (still air).

Unit

°C/W

The values in Table 8 are from simulations. The PCB is a JEDEC

multilayer board. Thermal performance for actual applications

requires careful inspection of the conditions in the application

to determine whether they are similar to those assumed in these

calculations.

Table 8.

Package Type

144-Ball CSP_BGA,

10 mm × 10 mm

(BC-144-1)

Airflow

Velocity

0 m/s

1 m/s

2.5 m/s

ΨJB

ΨJT

Unit

14.4 0.23 °C/W

14.0 0.50

13.9 0.53

ESD CAUTION

Rev. 0 | Page 9 of 32

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