TDA8948J 데이터 시트보기 (PDF) - NXP Semiconductors.
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TDA8948J Datasheet PDF : 26 Pages
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NXP Semiconductors
TDA8948J
4-channel audio amplifier
13.2 Printed-circuit board
13.2.1 Layout and grounding
To obtain a high-level system performance, certain grounding techniques are essential.
The input reference grounds have to be tied with their respective source grounds and
must have separate tracks from the power ground tracks; this will prevent the large
(output) signal currents from interfering with the small AC input signals. The small signal
ground tracks should be physically located as far as possible from the power ground
tracks. Supply and output tracks should be as wide as possible for delivering maximum
output power.
220 nF
4Ω
4Ω
4Ω
TVA
100 nF
1
220 nF
4.7 nF
AUDIO POWER CS NIJMEGEN
1
CIV
SVF
22
220
µF
µF
220 nF
220 nF
4Ω
4Ω
220 nF
4Ω
150
µF
MODE1
OFF
10 kΩ 10 kΩ
ON
SB ON
+Vp
IN2+
IN1+
IN3+
IN4+ VOL.Sgnd
MUTE
Fig 13. Printed-circuit board layout (single-sided); components view
mce483
13.2.2 Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to the
device and grounded to the power ground. Proper power supply decoupling also prevents
oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor with
low Equivalent Series Resistance (ESR), typical 100 nF, has to be placed as close as
possible to the device. For suppressing lower frequency noise and ripple signals, a large
electrolytic capacitor, e.g. 1000 µF or greater, must be placed close to the device.
The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For
good Total Harmonic Distortion (THD) and noise performance a low ESR capacitor is
recommended.
TDA8948J_1
Product data sheet
Rev. 01 — 27 February 2008
© NXP B.V. 2008. All rights reserved.
17 of 26
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