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VR68000001504JAC00 데이터 시트보기 (PDF) - Unspecified

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VR68000001504JAC00 Datasheet PDF : 10 Pages
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www.vishay.com
TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• IEC 60115-1, generic specification (includes tests)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out with reference to IEC 60115-1, in
accordance with IEC 60068-2-xx test method and under
standard atmospheric conditions in accordance with
IEC 60068-1, 5.3.
A climatic category 55 / 155 / 56 is applied, defined by the
lower category temperature (LCT = -55 °C), the upper
category temperature (UCT = 155 °C), and the duration
of exposure in the damp heat, steady state test (56 days).
VR25, VR37, VR68
Vishay BCcomponents
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31.
In test procedures and requirements table, only the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given.
TESTS PROCEDURES AND REQUIREMENTS
IEC 60115-1IEC 60068-2
CLAUSE
TEST METHOD
TEST
PROCEDURE
4.6.1.1
4.7
4.8
Insulation resistance Umax. DC = 500 V during 1 min; V-block method
Voltage proof
URMS = Uins; 60 s
Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C
REQUIREMENTS
PERMISSIBLE CHANGE
(Rmax.)
Rins min.: 10 000 M
No breakdown or flashover
± 200 ppm/K
VR25: max. 5 μV/V
4.12
Noise
IEC 60195
VR37: max. 2.5 μV/V
VR68: max. 2.5 μV/V
Room temperature; 2.5 x P70 x R ;
4.13
Short time overload
(voltage not more than 2 x limiting voltage);
R max.: ± 2 % R
10 cycles; 5 s ON and 45 s OFF
4.16
21 (Ua1)
21 (Ub)
21 (Uc)
Robustness of
terminations
Tensile, bending, and torsion
No damage
R max.: ± 0.5 % R
+235 °C; 2 s; solder bath method; SnPb40
+245 °C; 3 s; solder bath method; SnAg3Cu0.5
(before aging)
Good tinning (95 % covered);
no damage
4.17
20 (Ta)
Solderability
+235 °C; 2 s; solder bath method; SnPb40
+245 °C; 3 s; solder bath method; SnAg3Cu0.5
(after aging)
Good tinning (95 % covered);
no damage
4.18
20 (Tb)
Resistance to
soldering heat
Unmounted components
(260 ± 5) °C; (10 ± 1) s
R max.: ± 0.5 % R
4.19
14 (Na)
Rapid change
of temperature
30 min at -55 °C and 30 min at +155 °C;
5 cycles
R max.: ± 0.5 % R
4.20
29 (Eb)
Bump
3 x 1500 bumps in 3 directions; 40 g
No damage
R max.: ± 0.5 % R
4.22
6 (Fc)
Vibration
10 sweep cycles per direction;
10 Hz to 2000 Hz;
1.5 mm or 200 m/s2
No damage
R max.: ± 0.5 % R
4.23
Climatic sequence:
4.23.2
2 (Bb)
Dry heat
16 h; 155 °C
4.23.3
30 (Db)
Damp heat
cyclic
24 h; 25 °C to 55 °C;
90 % to 100 % RH
4.23.4
4.23.5
1 (Ab)
13 (M)
Cold
Low air pressure
2 h; -55 °C
2 h; 8.5 kPa;
15 °C to 35 °C
Rins min.: 1 G
R max.: ± 1.5 % R
4.23.6
30 (Db)
Damp heat
remaining cyclic
5 days; 55 °C;
95 % to 100 % RH; 5 cycles
4.23.7
DC load
Apply rated power for 1 min
Revision: 21-Sep-2018
7
Document Number: 28907
For technical questions, contact: filmresistorsleaded@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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