BAW56W,115 데이터 시트보기 (PDF) - NXP Semiconductors.

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BAW56W,115

High-speed switching diodes

NXP Semiconductors. 

NXP Semiconductors

BAV756S; BAW56 series

High-speed switching diodes

3.40

1.20 (2x)

4.60 4.00 1.20

2

1

3

solder lands

solder resist

occupied area

2.80

4.50

Dimensions in mm

preferred transport direction during soldering

sot023

Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)

1.30

R = 0.05 (12×)

0.30

R = 0.05 (12×)

0.35

(2×)

0.90 0.20

0.25

(2×)

0.60 0.70 0.80

0.30

(2×)

0.30

0.40

(2×)

0.40

0.50

(2×)

0.50

solder lands

solder paste

solder resist

occupied area

Dimensions in mm

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)

BAV756S_BAW56_SER_5

Product data sheet

Rev. 05 — 26 November 2007

© NXP B.V. 2007. All rights reserved.

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