BAW56(2015) 데이터 시트보기 (PDF) - NXP Semiconductors.

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BAW56
(Rev.:2015)

High-speed switching diodes

NXP Semiconductors. 

Nexperia

BAV756S; BAW56 series

High-speed switching diodes

2.2

1.2

(2×)

1.4

(2×)

4.6 2.6

1.4

solder lands

solder resist

occupied area

Dimensions in mm

preferred transport direction during soldering

2.8

4.5

sot023_fw

Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)

1.3

0.7

R0.05 (12×)

0.9

0.25

(2×)

0.3

(2×)

0.4

(2×)

0.6 0.7

0.3

0.4

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)

solder lands

solder resist

solder paste

occupied area

Dimensions in mm

sot883_fr

BAV756S_BAW56_SER

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 6 — 18 March 2015

© Nexperia B.V. 2017. All rights reserved

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