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CH1786NH 데이터 시트보기 (PDF) - Cermetek Microelectronics

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CH1786NH
Cermetek
Cermetek Microelectronics Cermetek
CH1786NH Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
Cermetek Microelectronics, Inc.
2. The circuitry from the CH1786 to the telephone
line interface must be provided in wiring that
carries no other circuitry other than that
specifically allowed in the FCC rules (such as A
and A1 leads).
3. Connection to phone line should be made
through an RJ-11C jack.
4. PCB traces from the modem’s RING and TIP pins
to the RJ-11C jack must be 0.1 inch spacing or
greater to one another and 0.2 inch spacing or
greater to all other traces. The traces should
have a nominal width of 0.020 inches or greater.
5. The RING and TIP PCB traces should be as
short as possible and oriented to prevent
coupling other high speed or high frequency
signals present on the host circuit PCB.
6. No additional circuitry other than that shown in
Figure 7A or 7B may be connected between the
modem module and the RJ-11C jack. Doing so
will invalidate the FCC approval.
7. The CH1786LC, CH1786LCNE, and CH1786NH
(only) requires external surge protection (see
Figure 7B). This is mandatory to maintain FCC
Part 68 conveyed approval.
8. The CH1786, the RJ-11C jack, the interfacing
circuitry and all PCB traces in between, must be
contained on a PCB with a 94 V-0 flammability
rating.
9. The supplied FCC registration label must be
applied visibly on the outside of the product.
10. The product’s User Manual must provide the user
with instructions for connection and use as
recommended in the FCC Registration Section
below.
CH1786 Family of Ultra Small 2400bps Modems
CH1786 HANDLING AND ASSEMBLY
RECOMMENDATIONS
The CH1786 contains static-sensitive components
and should only be handled by personnel and in
areas that are properly protected against static
discharge. The two recommended mounting
techniques for physically connecting the CH1786 to a
PCB are discussed below.
Direct Soldering. The CH1786 may be wave
soldered. All CH1786 products are hermetically
sealed (except the CH1786LCNE, CH1786NE, and
CH1786NH) and will not be harmed by industry
standard wave soldering processes. Cermetek
recommends against exposing the non-hermetic
CH1786LCNE, CH1786NE, and CH1786NH to
aqueous based rinsing processes.
Socketing. The socketing approach to mounting
eliminates cleaning and desoldering concerns. When
the socket is used, it must make a solid connection to
all pins. Failure to do so will cause unreliable or
intermittent operation. Also, steps should be taken to
assure that the module remains tightly seated in the
socket during shipping. Cermetek recommends using
sockets from Samtec. See Application Note # 130,
Summary of Recommended Suppliers.
FCC REGISTRATION
All products in the CH1786 family are registered with
the FCC (Federal Communications Commission)
under Part 68. To maintain the validity of the
registration, you must serve notice to the end user of
the products of several restrictions the FCC places on
the modem and its use.
In addition to restriction notification, the FCC requires
that Cermetek make all repairs to all products in the
CH1786 family. If repairs are necessary after
installation of the CH1786 in the end product and the
end product has been delivered to the end user, the
end product must be returned to the end product
supplier where the CH1786 can be removed and then
forward to Cermetek for repair. The following notice
is recommended and should be included in the end
product’s user manual.
Figure 6. Speaker Control Circuit: Optional to
allow for call progress monitoring.
2003 Cermetek Microelectronics, Inc.
FOR YOUR USER’S MANUAL
The FCC Part 68 rules require the following (or
equivalent) be provided to the end user of equipment
containing a DAA.
Type of Service. The (insert end product name) is
designed to be used on standard device telephone
lines. It connects tot he telephone line by means of a
standard jack called the USOC RJ-11C (or USOC
RJ45S). Connection to telephone-company-provided
coin service (central office implemented systems) is
Page 11
Document No. 607-0004 Revision L1 (06/03)

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