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Package Outline
Unit: mm
CXK5B81020J
32
32PIN SOJ (PLASTIC) 400mil
+ 0.4
20.96 – 0.12
17
CXK5B81020J/TM
R0.254 1
0.73 ± 0.08
16
1.27
+ 0.2
2.2 – 0.11
0.1
0.43 ± 0.1
0.95
φ0.178 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOJ-32P-01
∗SOJ032-P-0400-A
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
SOLDER PLATING
42 / COPPER ALLOY
1.3g
CXK5B81020TM
32
32PIN TSOP (II) (PLASTIC) 400mil
∗20.95 ± 0.1
17
A
1.27 MAX
0.1
1
1.27
0.4 ± 0.1
16
0.21 M
+ 0.05
0.127 – 0.02
0.1 ± 0.1
NOTE: Dimension “∗” does not include mold protrusion.
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP (II) -32P-L01
TSOP (II) 032-P-0400-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
42 ALLOY
–9–