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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

1206L012 데이터 시트보기 (PDF) - Littelfuse, Inc

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1206L012 Datasheet PDF : 5 Pages
1 2 3 4 5
POLYFUSE® Resettable PTCs
Surface Mount > 1206L Series
Soldering Parameters
Condition
Peak Temp/ Duration Time
Time above liquids (TAL) 220°C
Preheat 120°C~ 180°C
Storage Condition
Reflow
260°C / 10 Sec
60 Sec ~ 100 Sec
50 Sec ~ 150 Sec
0°C~35°C, 70%RH
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oven, N2 environment for lead–free
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t% FWJDFTDBOCFDMFBOFEVTJOHTUBOEBSEJOEVTUSZNFUIPETBOE
solvents.
Note:*GSFnPXUFNQFSBUVSFTFYDFFEUIFSFDPNNFOEFEQSPmMF
devices may not meet the performance requirements.
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin (Sn))
Lead Solderability
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ANSI/J-STD-002 Category 3.
Soldering
260
220
Preheating
180
120
Cooling
0
50 to 150
60 to 100
120
Time(s)
Environmental Specifications
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped
State
Passive Aging
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+5% typical resistance change
Humidity Aging
+85°C, 85%, R.H.,1000 hours
-/+5% typical resistance change
Thermal Shock
MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
MIL–STD–202, Method 215
No change
Vibration
MIL–STD–883C, Method 2007.1,
Condition A
No change
Moisture Sensivity Level Level 1, J–STD–020C
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/1206L.html for current information.
Revised: May 26, 2009
1206L Series

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