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ACS374D 데이터 시트보기 (PDF) - Intersil

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ACS374D Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
ACS374MS
Die Characteristics
DIE DIMENSIONS:
102 mils x 102 mils
2,600mm x 2,600mm
METALLIZATION:
Type: AlSiCu
Metal 1 Thickness: 6.75kÅ (Min), 8.25kÅ (Max)
Metal 2 Thickness: 9kÅ (Min), 11kÅ (Max)
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
DIE ATTACH:
Material: Silver Glass or JM 7000 after 7/1/95
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
> 4.3 mils x 4.3 mils
> 110µm x 110µm
Metallization Mask Layout
ACS374MS
D0 Q0 OE VCC Q7 D7
(3)
(2)
(1) (20) (19) (18)
D1 (4)
Q1 (5)
NC
NC
Q2 (6)
D2 (7)
(17) D6
(16) Q6
NC
NC
(15) Q5
(14) D5
(8)
(9) (10) (11) (12) (13)
D3
Q3 GND CP
Q4
D4
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518820
8

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