HCS245MS 데이터 시트보기 (PDF) - Intersil
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HCS245MS Datasheet PDF : 7 Pages
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HCS245MS
Die Characteristics
DIE DIMENSIONS:
124 x 110 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± -2.6kÅ
DIE ATTACH:
Material: Silver Epoxy
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS245MS
DIR VCC
OE
NC
NC
(1)
(20) NC
NC
(19)
A0 (2)
A1 (3)
A2 (4)
A3 (5)
A4 (6)
(18) B0
(17) B1
(16) B2
(15) B3
(14) B4
A5 (7)
(8)
(9)
(10)
(11)
(12)
A6
A7
GND
B7
B6
7-481
(13) B5
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